IBM researchers, along with scientists at the California Institute of Technology, have discovered that the tiny components that run along a chip’s silicone surface will self-adhere to previously laid down DNA patterns.
IBM researchers, along with scientists at the California Institute of Technology, have discovered that the tiny components that run along a chip’s silicone surface will self-adhere to previously laid down DNA patterns.
“The combination of this directed self-assembly with today’s fabrication technology could lead to substantial savings in the most expensive and challenging part of the chip-making process,”